Tepla plasma cleaner

Oxygen plasma system used for substrate cleaning, descum processes, and aggressive resist stripping. A Faraday cage can be used during sample processing to protect ESD sensitive devices. Samples up to 6” in diameter can be put into the Tepla.  Samples can be placed on a blank silicon carrier wafer or on the special quartz sample holder.

Superuser:  Thomas Hazard  thazard@princeton.edu